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Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages
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Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages (Hardback)

Usually despatched within 2 weeks.


For advanced courses in digital design.

This state-of-the-art book provides students with techniques for predicting and achieving target performance levels. Gives students all the theory, practice, general signal integrity issues, and leading-edge experimental techniques they need to accurately model and simulate those interconnections and predict real-world performance.

BRIAN YOUNG is a Member of the Technical Staff at the Somerset Design Center, Semiconductor Product Sector, Motorola, working on packaging, interconnects, and I/O design for PowerPC microprocessors and the RapidIO Interconnect Architecture. For over seven years he has specialized in simulation, modeling, measurement, and performance studies for high-speed signaling with microprocessors, fast static RAMs, and DSPs. He has served as an Assistant Professor in the Department of Electrical Engineering at Texas A&M University, College Station, and as an adjunct professor in the Department of Electrical Engineering at the University of Texas, Austin. Dr. Young holds a Ph.D from the University of Texas, Austin and holds six patents related to packaging. He has published numerous articles in conferences and journals.

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