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Distributed Embedded Systems: Design, Middleware and Resources: IFIP 20th World Computer Congress, TC10 Working Conference on Distributed and Parallel Embedded Systems (DIPES 2008), September 7-10, 2008, Milano, Italy
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Distributed Embedded Systems: Design, Middleware and Resources: IFIP 20th World Computer Congress, TC10 Working Conference on Distributed and Parallel Embedded Systems (DIPES 2008), September 7-10, 2008, Milano, Italy (Hardback)

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Synopsis

This year, the IFIP Working Conference on Distributed and Parallel Embedded Sys tems (DIPES 2008) is held as part of the IFIP World Computer Congress, held in Milan on September 7 10, 2008. The embedded systems world has a great deal of experience with parallel and distributed computing. Many embedded computing systems require the high performance that can be delivered by parallel computing. Parallel and distributed computing are often the only ways to deliver adequate real time performance at low power levels. This year's conference attracted 30 submissions, of which 21 were accepted. Prof. Jor g Henkel of the University of Karlsruhe graciously contributed a keynote address on embedded computing and reliability. We would like to thank all of the program committee members for their diligence. Wayne Wolf, Bernd Kleinjohann, and Lisa Kleinjohann Acknowledgements We would like to thank all people involved in the organization of the IFIP World Computer Congress 2008, especially the IPC Co Chairs Judith Bishop and Ivo De Lotto, the Organization Chair Giulio Occhini, as well as the Publications Chair John Impagliazzo. Further thanks go to the authors for their valuable contributions to DIPES 2008. Last but not least we would like to acknowledge the considerable amount of work and enthusiasm spent by our colleague Claudius Stern in preparing theproceedingsofDIPES2008. Hemadeitpossibletoproducethemintheircurrent professional and homogeneous style.

Computing & ITComputer hardwareEmbedded systemsComputing & ITComputer networking & communicationsDistributed systems Publisher: Springer-Verlag New York Inc. Publication Date: 27/06/2008 ISBN-13: 9780387096605  Details: Type: Hardback Format: Books
Availability: Currently unavailable to order online.  

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