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Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability
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Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability (Hardback)

£115.00
Pre-order for despatch on publication.

Synopsis

The aim of this book is to provide readers with an in-depth understanding of current state-of-the-art in the use of co-design and modeling tools to predict reliability and robustness of advanced packaging and integration technologies for both micro and power electronic systems. Authored by world leading experts in the field the of multiphysics/multi-domain modeling, the book starts with an overview of advanced packaging and integration technologies which details the manufacturing and reliability challenges that need to be addressed in the development of, for example, 3D-IC, novel bumping technologies such a copper column, lead-free solders and nano-sintering, and packaging technologies such as wafer level packaging. The book then progresses to discuss state-of-the-art modeling tools and techniques and the evolving progression towards co-design, and multi-domain analysis to ensure reliability and robustness. Finally a number of chapters demonstrate the application of these modeling methodologies and toolsets to advanced packaging and integration technologies.

TechnicalElectronics & communications engineeringElectronics engineeringCircuits & components Publisher: World Scientific Publishing Co Pte Ltd Publication Date: 30/11/2020 ISBN-13: 9789814740203  Details: Type: Hardback Format: Books
Availability: Pre-order for despatch on publication. Pre-Order

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