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Embedded Dielectrics For Electronic Packaging
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Embedded Dielectrics For Electronic Packaging (Hardback)

£115.00
Pre-order for despatch on publication.

Synopsis

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

TechnicalElectronics & communications engineeringElectronics engineeringElectronic devices & materials Publisher: World Scientific Publishing Co Pte Ltd Publication Date: 31/07/2021 ISBN-13: 9789814619417  Details: Type: Hardback Format: Books
Availability: Pre-order for despatch on publication. Pre-Order

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