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19 Products
19 Products Page
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Solder Joint Reliability of BGA, CSP and Flip Chip Assemblies
Solder Joint Reliability of BGA, CSP and Flip Chip Assemblies
John H. Lau
Hardback
 
£39.99
This product is currently unavailable
Solder Joint Reliability
Solder Joint Reliability
John H. Lau
Paperback
 
£179.99
Usually dispatched within 3 weeks
Solder Joint Reliability
Solder Joint Reliability
John H. Lau
Hardback
 
£179.99
Usually dispatched within 3 weeks
Chip On Board
Chip On Board
John H. Lau
Hardback
 
£179.99
Usually dispatched within 3 weeks
Handbook Of Tape Automated Bonding
Handbook Of Tape Automated Bonding
John H. Lau
Hardback
 
£179.99
Usually dispatched within 3 weeks
Mechanics of Solder Alloy Interconnects
Mechanics of Solder Alloy Interconnects
Darrel R. Frear
Hardback
 
£179.99
Usually dispatched within 3 weeks
The Handbook of Fine Pitch Surface Mount Technology
The Handbook of Fine Pitch Surface Mount Technology
John H. Lau
Hardback
 
£72.00
This product is currently unavailable
Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
John H. Lau
Hardback
 
£72.00
This product is currently unavailable
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
John H. Lau
Hardback
 
£129.99
Usually dispatched within 3 weeks
Heterogeneous Integrations
Heterogeneous Integrations
John H. Lau
Hardback
 
£139.99
Usually dispatched within 3 weeks
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
John H. Lau
Paperback
 
£99.99
Usually dispatched within 3 weeks
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
John H. Lau
Hardback
 
£139.99
Usually dispatched within 3 weeks
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
John H. Lau
Hardback
 
£139.99
Usually dispatched within 3 weeks
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
John H. Lau
Paperback
 
£99.99
Usually dispatched within 3 weeks
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
John H. Lau
Paperback
 
£109.99
Usually dispatched within 3 weeks
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
Hardback
 
£159.99
This product is currently unavailable
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
Hardback
 
£149.99
This product is currently unavailable
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
Paperback
 
£109.99
Usually dispatched within 3 weeks
Electronic Packaging
Electronic Packaging
John H. Lau
Hardback
 
£42.99
This product is currently unavailable